• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The present invention provides a heater module capable of improving the temperature uniformity of the optical waveguide while maintaining the power consumption and the thickness of the optical waveguide module. The heater module 20 according to the present invention is a heater module 20 for heating the optical waveguide element and controlling the temperature of the optical waveguide element 12. The heater module 20 includes a heat generation circuit 22 that generates heat by energization, and a heat generation circuit. It is provided on the upper surface of 22, and provided with the heat-transfer part 21 in which the recessed groove part for mounting the optical waveguide element 12 was formed. By placing the optical waveguide element 12 on the bottom face of the heat transfer portion 21 in which the concave groove is formed, the optical waveguide element 12 can be heated not only from the bottom but also from the side surface by the edge portion constituting the concave groove portion. Therefore, temperature uniformity can be improved.
    公开号:KR20020024544A
    申请号:KR1020010058958
    申请日:2001-09-24
    公开日:2002-03-30
    发明作者:히로세요시유키；토미카와타다시；사이토히로히사
    申请人:오카야마 노리오；스미토모덴키고교가부시키가이샤；
    IPC主号:
    专利说明:

    Heater module and optical waveguide module
    [15] The present invention relates to a heater module for heating the optical waveguide device to control the temperature of the optical waveguide device, and an optical waveguide device having the same.
    [16] In the optical waveguide module, when the temperature distribution inside the optical waveguide element is large, the dimension of the optical waveguide changes due to the thermal expansion difference of the substrate depending on the place, which causes a problem in wavelength selectivity or switching characteristics. For this reason, the uniformity of the temperature inside an optical waveguide element is calculated | required.
    [17] Background Art Conventionally, Peltier elements and heaters have been used as devices for temperature control of optical waveguide elements. However, in the optical waveguide module, since it is necessary to pull the optical fiber used for the transmission of the optical signal to the external device into the module, it is difficult to seal hermeticly in the pulling portion. For this reason, reliability of a Peltier element cannot be ensured, and a heater is often used as a device for temperature regulation. The heater has a heat generating circuit (resistance) inside the insulating layer that generates heat by being energized, and heat from the heat generating circuit is transmitted to the optical waveguide element through the insulating layer. Conventionally, ceramic heaters, such as alumina (heat conductivity 20W / mK), which have comparatively low heat transfer rates, were often used. However, in recent years, especially in the field of optical communication, the trend toward large capacity and high speed communication has become remarkable, and in recent years, large-area optical waveguide devices have been used in conjunction with the transition to D-WDM (high density-wavelength multiple communication). It has been. Moreover, in any frequency width, the demand for multiplexing more signals is stronger than in the prior art, and the demand for temperature uniformity is increasing. For this reason, it is required to further raise the temperature uniformity in the optical waveguide element (± 0.5 ° C or lower).
    [18] In order to satisfy the requirement of the temperature uniformity of such an optical waveguide element, two systems are currently examined. The 1st system is a method of using the crack board using Cu alloy etc. which have high thermal conductivity. It is a method of improving temperature uniformity by uniformly diffusing heat generated by an alumina heater by a crack plate and then transferring it to an optical waveguide device. In the second method, the heater itself is formed of AlN (thermal conductivity 170 W / mK) or the like having a thermal conductivity of about 10 times that of conventionally used alumina, and the heat generated by the heater is uniformly diffused in the heater itself, It is a method of improving temperature uniformity by transferring to a waveguide element. By employing such a method, the temperature distribution of the optical waveguide element can be made ± 0.5 ° C or less.
    [19] However, in recent years, the demand for D-WDM is rapidly becoming strict, and multiplexing is further desired. Accompanying this, an optical waveguide element is required to have high temperature uniformity as compared with the prior art. On top of that, photonic networks that utilize optical switching and the like and do not use any electrical elements have been studied. In order to realize this, devices using new materials such as LiNbO 3 and resin waveguides different from conventional quartz and silica have been studied as optical waveguide devices. Such devices require more stringent temperature uniformity than in the prior art, and an optical waveguide device may require a temperature uniformity of ± 0.1 ° C or less.
    [20] In order to solve this problem, as shown in FIG. 7, when the thickness of the ceramic heater 73 and the thickness of the crack plate 72 are thickened, the temperature uniformity of the optical waveguide element 71 is improved. An attempt was made to realize a temperature uniformity of ± 0.1 ° C or lower. As a result, although the temperature uniformity of the surface joined to the ceramic heater 73 and the crack plate 72 in the optical waveguide element 71 is maintained, it is to be bonded to the ceramic heater 73 and the crack plate 72. On the other side, it was found that the optical waveguide element 71 is cooled by being exposed to environmental temperature, and it is impossible to realize temperature uniformity within ± 0.1 ° C.
    [21] In order to prevent the upper part of the optical waveguide element 71 from cooling as mentioned above, the method of heating by both heaters from the upper and lower surfaces of the optical waveguide element 71, and a heating heater shown in FIG. 8 instead of ceramics are shown. As described above, a method of forming a silicon 74 or a polyimide heater that can be bent freely, processing the heater into a cylindrical shape, and providing an optical waveguide element 71 at the center thereof is conceivable.
    [22] However, in the above method, not only the optical waveguide element 71 but also the entire optical module is heated, and the power consumption increases by about two times or more as compared with the case where only the lower surface of the optical waveguide element 71 is heated. there is a problem. There is also a problem that the thickness of the optical waveguide module cannot be avoided. The thickness required for the optical waveguide module is about 10 mm in general as the thickness of modules other than the optical waveguide module. However, in the above method, the thickness of the optical waveguide module becomes about 20 to 30 mm. For this reason, in the device in which the optical waveguide module is mounted, the design rule in the case of designing a device composed only of other devices cannot be applied, and design is particularly necessary, so that the design efficiency, the design cost, and the overall cost of the device are Will rise.
    [23] Accordingly, an object of the present invention is to provide a heater module capable of improving the temperature uniformity of an optical waveguide while maintaining the power consumption and the thickness of the optical waveguide module, and an optical waveguide module having the same. .
    [24] The heater module according to the present invention is a heater module for heating the optical waveguide element to control the temperature of the optical waveguide element. The heater module is provided on a heat generating circuit that generates heat by energization and an upper surface of the heat generating circuit, and lifts the optical waveguide element. And a heat transfer part having a concave groove portion for laying.
    [25] In this invention, the recessed groove part is formed in the heat-transfer part for heating an optical waveguide element, and an optical waveguide element is mounted on this recessed groove part. The present inventors found that the optical waveguide element can be heated not only from the bottom but also from the side surface by the edge portion constituting the concave groove portion, thereby improving the temperature uniformity. In addition, according to the configuration of the present invention, since the heat is transferred from the edge portion of the concave groove portion formed in the integral heat transfer portion, as shown in FIG. 9, the heater 75 for heat generation on the bottom and side surfaces of the optical waveguide element 71, respectively. No need to install In addition, since the optical waveguide element can be mounted so as to be inserted into the concave groove formed in the heat transfer portion, a heating module for heating the upper surface of the optical waveguide element is unnecessary, and a heater module capable of increasing the temperature uniformity with a simple configuration is provided. It can be realized. Thereby, the thickness of the optical waveguide module using the optical waveguide element can be kept equal to the case where only the optical waveguide element is placed on the heat transfer unit.
    [26] In the heater module, the heat transfer unit may be made of AlN ceramics.
    [27] By configuring the heat transfer portion with AlN ceramics having high thermal conductivity, the temperature uniformity of the optical waveguide element to be heated can be further increased.
    [28] In the heater module, an insulating layer is preferably provided between the heating circuit and the heat transfer portion.
    [29] An optical waveguide module according to the present invention includes the heater module, an optical waveguide element mounted on a concave groove formed in the heat transfer part, and a case accommodating the heater module and the optical waveguide element.
    [30] Thus, the temperature uniformity of an optical waveguide element can be improved by constructing an optical waveguide module which heats an optical waveguide element using said heater module. In addition, the optical waveguide module can be realized with a simple configuration, and the thickness of the optical waveguide module can be maintained on the same basis as when only the optical waveguide element is placed on the heat transfer part.
    [31] Further, in the optical waveguide module, a medium in the form of a gas is interposed between the edge portion of the concave groove portion and the optical waveguide element, and the upper surface of the edge portion constituting the concave groove portion is placed on the bottom surface of the concave groove portion. It is preferable that the height of the optical waveguide element is higher than the upper surface of the laid optical waveguide element, or the height difference from the upper surface of the optical waveguide element is 0.1 mm or less, or 1/10 or less of the height of the optical waveguide element.
    [32] The role of the edge portion of the concave groove portion is to transmit heat, which is transferred to the heat transfer portion, to the optical waveguide element, and the heat from the edge portion is transmitted through the gaseous medium filled between the optical waveguide element and the edge portion. When the upper surface of the edge portion is lower than the upper surface of the optical waveguide element, heat is transmitted to the optical waveguide element up to the height of the upper surface of the edge portion, but heat is not transmitted to the optical waveguide element for the portion higher than the edge portion. In this case, the upper surface of the optical waveguide element is cooled according to the environmental temperature. As a result of simulating the relationship between the height of the edge portion and the temperature uniformity, the difference is 0.1 mm or less when the upper surface of the edge portion is higher than the upper surface of the optical waveguide element or the upper surface of the optical waveguide element is higher than the edge portion. When it is 1/10 or less of the height of an optical waveguide element, it becomes clear that desired temperature uniformity (± 0.1 degreeC or less) can be implement | achieved.
    [33] Further, in the optical waveguide module, a medium in the form of a gas is interposed between the edge portion of the concave groove portion and the optical waveguide element, and the width of the space partitioned between the edge portion and the optical waveguide element is 0.02. It is preferable that they are mm or more and 1.0 mm or less.
    [34] When the width of the space between the edge portion and the heat transfer portion is smaller than 0.02 mm, a part where the heat transfer portion and the optical waveguide element partially contact due to the processing accuracy of the heat transfer portion is secured, thereby ensuring the temperature uniformity of the optical waveguide element. Can not. In addition, when the width of the space between the edge portion and the heat transfer portion is larger than 1.0 mm, heat cannot be efficiently transferred to the side surfaces of the optical waveguide element when convection occurs due to a partial temperature difference or the like in the optical waveguide module. Temperature uniformity cannot be ensured. Therefore, the width of the space between the edge portion and the heat transfer portion is preferably 0.02 mm or more and 1.0 mm or less. Depending on the structure of the optical waveguide module, since the convection is not affected in the space, the width of the space is more preferably 0.5 mm or less.
    [35] The optical waveguide module may further include a resin interposed in a space partitioned between the edge portion and the optical waveguide element.
    [36] Thus, by interposing a resin in a space partitioned between the edge portion and the optical waveguide element, heat can be transferred from the heat transfer portion to the optical waveguide element depending on the resin.
    [37] In the optical waveguide module, the resin may be formed of a grease-like substance.
    [38] By using the grease-type resin in this way, since thermal stress does not act on the side surfaces of the optical waveguide element, even when a stress-sensitive optical waveguide element is used, the risk of damage to the optical waveguide element can be reduced.
    [1] 1 is an exploded perspective view showing an optical waveguide module according to a first embodiment;
    [2] Fig. 2 is a sectional view showing the optical waveguide module according to the first embodiment.
    [3] 3 is a sectional view showing the optical waveguide module according to the first embodiment;
    [4] 4 is an explanatory diagram illustrating a case of an optical waveguide module.
    [5] Fig. 5 is an exploded perspective view showing the optical waveguide module according to the second embodiment.
    [6] Fig. 6 is a sectional view showing the optical waveguide module according to the second embodiment.
    [7] 7 shows a conventional heater module.
    [8] 8 shows a conventional heater module.
    [9] 9 shows a conventional heater module.
    [10] Description of simple symbols for the main parts of the drawing
    [11] 10 optical waveguide module 12 optical waveguide device
    [12] 20: heater module 21: heat transfer unit
    [13] 22: heat generating circuit 23: electrode
    [14] 30: case 41: resin
    [39] Hereinafter, a preferred embodiment of the optical waveguide module according to the present invention as described in detail. In addition, in description of drawing, the same code | symbol is attached | subjected to the same element, and the overlapping description is abbreviate | omitted.
    [40] 1 is a perspective view showing the configuration of the optical waveguide module 10 according to the first embodiment, Figure 2 is a cross-sectional view of the optical waveguide module 10 in the II-II direction, Figure 3 is an optical waveguide module 10 It is sectional drawing of the III-III direction of FIG. 4, and FIG. 4 is explanatory drawing explaining the case 30. As shown in FIG. The optical waveguide module 10 includes a 50x10x1mm quartz optical waveguide element 12, a heater module 20 for heating the optical waveguide element 12, an optical waveguide element 12 and a heater. The case 30 which accommodates the module 20 is provided.
    [41] As shown in FIG. 2, the heater module 20 is comprised from the heat generating circuit 22 which generate | occur | produces electricity by electricity with a resistance of 0.5-10 ohms, and the heat-transfer part 21 provided in the upper surface of the heat generating circuit 22. It is. The heat generating circuit 22 is made of tungsten, molybdenum, silver palladium, or the like. Both ends of the heat generating circuit 22 are provided with electrodes 23 for passing a current through the heat generating circuit 22. The heat transfer part 21 provided on the upper surface of the heat generation circuit 22 is formed of the AlN ceramic layer 21 having high thermal conductivity. As shown in FIG. 3, the heat-transfer part 21 is formed with the recessed groove part, The optical waveguide element 12 is fitted in the edge part 21a which comprises the recessed groove part, and the bottom face 21b of the recessed groove part is carried out. Put on. The resin 41 is filled between the mounted optical waveguide element 12 and the bottom face 21b of the concave groove portion and between the optical waveguide element 12 and the edge portion 21a. The heat transferred from the heat generating circuit 22 diffuses almost uniformly in the AlN ceramic layer 21. As a result, heat is transferred from the bottom surface 21b and the edge portion 21a of the concave groove portion via the resin 41, and the optical waveguide element 12 placed on the upper surface of the AlN ceramic layer 21 is uniformly heated. The temperature uniformity of the optical waveguide element 12 can be improved. In addition, since AlN ceramics have high moisture resistance, the resistance value of the heat generating circuit 22 does not change even after long-term continuous use, and high reliability is obtained. Here, the manufacturing method of the heater module 20 is demonstrated. First, the heat generating circuit 22 and the electrode 23 are printed on the preform sheet of AlN ceramics by W paste. Subsequently, a preform sheet of AlN ceramics is adhered to the upper surface of the heat generating circuit 22 to produce a pseudo molded body of the heater module 20. And this sintered compact is sintered in nitrogen atmosphere 1700 degreeC or more, concave groove part is formed in AlN ceramics, and the heater module 20 is completed. When placing the optical waveguide element 12 on the heater module 20, for example, the amount of resin to be used at the time of joining the optical waveguide element 12 and the concave groove bottom face 21b is set slightly higher. The resin 41 overflows when the optical waveguide element 12 and the heat transfer portion 21 are bonded to each other. Then, the overflowing resin 41 is used to fill the space between the optical waveguide element 12 and the edge portion 21a of the concave groove portion. The resin 41 used in this embodiment is a silicone resin, but it is also possible to use an epoxy resin. In addition, in order to reduce the stress acting on the optical waveguide element 12, it is also possible to replace a part with grease, such as resin 41 in contact with the side surface of the optical waveguide element 12 as a grease-type resin. .
    [42] The case 30 consists of a package board | substrate 31 to which the lead pin 32 for energizing the heat generating circuit 22 is soldered, and the cover 35 which covers the said package board | substrate 31 (refer FIG. 1). ). Here, the package substrate 31 has a role of supporting the heater module 20. Moreover, as a dimension of the whole package, it is 100x50x10 mm. As shown in FIG. 4, an insertion opening 35a for inserting the optical fiber 14 is formed on the rear surface of the case 30 facing the cover 35. The package board | substrate 31 has the flat plate 31a to which the lead pin 32 is soldered, and the support plate 31b adhere | attached on both lower ends of the flat plate 31a (refer FIG. 2). By providing the support plate 31b in this manner, when the optical waveguide module 10 is mounted on a system board or the like, it is possible to prevent an excessive load on the lead pin 32. In addition, the cover 35 and the package board | substrate 31 are adhere | attached with resin. The resin used in the present embodiment is a silicone resin which is effective in preventing deformation during bonding, but it is also possible to use an epoxy resin. Moreover, the cover 35 and the package substrate 31 are formed with copper tungsten as a main component. For this reason, the temperature uniformity in the case 30 is high and the temperature uniformity of the optical waveguide element 12 can be improved. Moreover, even when the case 30 is formed with cobalt, iron, nickel, alumina, or aluminum nitride as a main component, the same effect can be obtained. In addition, in the case where the case 30 is formed of a resin or silica glass which is a material having high heat insulation as a main component, it is possible to suppress the heat in the case 30 from being released to the outside, so that the temperature of the optical waveguide element 12 The fall can be prevented.
    [43] In the optical waveguide module 10 according to the present embodiment, a concave groove is formed in the heat transfer part 21 of the heater module that heats the optical waveguide element 12, and the optical waveguide element 12 is placed on the concave groove. Is laying. Thereby, the optical waveguide element 12 is heated from the bottom face 21b and the edge portion 21a of the concave groove portion, and the temperature uniformity of the optical waveguide element 12 can be improved. The temperature uniformity of the optical waveguide element 12 was observed by a thermo viewer under the condition of the temperature of the heater module 20 at 80 ° C. and the environment temperature at 0 ° C., thereby suppressing the temperature distribution to ± 0.1 ° C. Could. Moreover, about temperature controllability, even when it changed in the range of -40-70 degreeC, it showed only the temperature change of ± 0.2 or less, and it turned out that it is hard to be influenced by external temperature. In addition, the warpage of the heater module 20 and the optical waveguide element 12 is small, no anisotropy is observed in the optical waveguide characteristics, and no problems such as an increase in loss, switching characteristics, and polarization dependence due to birefringence are not caused. .
    [44] In addition, since the optical module according to the present embodiment can heat the optical waveguide element 12 from the edge portion 21a and the bottom surface 21b by one heating circuit 22, the temperature is reduced while the power consumption is reduced. The uniformity can be improved. In the experiment performed on the above conditions, the power consumption was 3 W or less.
    [45] Next, the optical waveguide module 50 according to the second embodiment of the present invention will be described. FIG. 5 is a perspective view showing the optical waveguide module 50 according to the second embodiment, and FIG. 6 is a VI-VI cross-sectional view of the optical waveguide module 50. The optical waveguide module 50 according to the second embodiment has the same basic configuration as the optical waveguide module 10 according to the first embodiment, but the configuration of the heater module 60 for heating the optical waveguide element 12 is different. .
    [46] As shown in FIG. 6, the heater module 60 in the second embodiment includes a heat generation circuit 62 that generates heat by energization, an insulating layer 61 provided on an upper surface of the heat generation circuit 62, The upper surface of the insulating layer 61 has a crack plate 65 provided via a resin 64. The heat generating circuit 62 is made of tungsten, molybdenum, silver palladium, or the like. At both ends of the heat generating circuit 62, electrodes 63 for passing a current through the heat generating circuit 62 are provided. The insulating layer 61 provided on the upper surface of the heat generating circuit 62 is made of alumina ceramics, and the crack plate 65 provided on the upper surface of the insulating layer 61 is made of Cu alloy. As shown in FIG. 5, the recessed groove part is formed in the crack board 65, and the optical waveguide element 12 is fitted to the edge part which comprises a recessed groove part, and is mounted on the bottom face of the recessed groove part. The heat transmitted from the heat generating circuit 62 diffuses almost uniformly in the crack plate 65. As a result, heat is transferred uniformly to the optical waveguide element 12 placed on the upper surface of the crack plate 65 at the bottom and the edge thereof, thereby increasing the temperature uniformity of the optical waveguide element 12. .
    [47] Also in the optical waveguide module 50 having the heater module 60 configured as described above, similarly to the optical waveguide module 10 according to the first embodiment, the effect of increasing the temperature uniformity of the optical waveguide element 12 is obtained. Lose. In this embodiment, although the ceramic heater made of alumina ceramics is used as the insulating layer 61, other ceramics, for example, AlN ceramics, may be used. In addition, using silicon rubber and polyimide instead of ceramics can achieve almost the same results as the optical waveguide module 50 according to the second embodiment. Further, the crack plate 65 is not limited to the Cu alloy, and may be a metal having high thermal conductivity such as Al alloy. Next, an optical waveguide module according to a third embodiment of the present invention will be described. The optical waveguide module according to the third embodiment has the same basic configuration as the optical waveguide module 50 according to the second embodiment, but is filled in the space between the edge portion 21a and the optical waveguide element 12 constituting the concave groove. Instead of the resin 41, the air is filled.
    [48] In the optical waveguide module having such a configuration, the temperature uniformity of the optical waveguide element is measured by changing the width (corresponding to the width D shown in FIG. 3) between the edge of the concave groove portion and the optical waveguide element. Table 1 shows the results of one experiment. Here, the heights of the upper surface of the optical waveguide element and the upper surface of the edge portion 21a of the concave groove portion are the same.
    [49] Space width (mm)Temperature uniformity (℃) Sample 1 *0.01± 0.2 Sample 20.02± 0.1 Sample 30.1± 0.07 Sample 40.5± 0.09 Sample 51.0± 0.1 Sample 61.5± 0.3
    [50] -The heating element and the optical waveguide element have the same height.
    [51] -* Shows a comparative example.
    [52] As can be seen from this table, when the width of the space between the edge portion 21a of the concave groove portion and the optical waveguide element is 0.02 or more and 1.0 mm or less, temperature uniformity ± 0.1 ° C or less can be achieved.
    [53] In addition, in Experiment 1, Table 2 shows the results of Experiment 2 in which the outside of the optical waveguide module is forcedly air-cooled at a wind speed of 5 m / s.
    [54] Space width (mm)Temperature uniformity (℃) Sample 7 *0.01± 0.2 Sample 80.02± 0.1 Sample 90.1± 0.07 Sample 100.5± 0.09 Sample 111.0± 0.2
    [55] -The heat transfer part and the optical waveguide element have the same height and are forced to air-cooled at a wind speed of 5 m / s.
    [56] -* Indicates a comparative example
    [57] As can be seen from this table, when the width of the space between the edge portion 21a of the concave groove portion and the optical waveguide element is 0.02 or more and 0.5 mm or less, temperature uniformity ± 0.1 ° C or less can be achieved.
    [58] Next, in the optical waveguide module according to the third embodiment, the height of the edge portion 21a of the concave groove portion and the height of the optical waveguide element were changed relatively to measure the temperature uniformity of the optical waveguide element. The results are shown in Table 3. Here, the height of the optical waveguide device was 1.2 mm in width between the 1.2 mm optical waveguide device and the edge 21a of the concave groove portion.
    [59] Positional relationship between the optical waveguide element and the edge (mm)Temperature uniformity (℃) Sample 12 *0.01± 0.07 Sample 130.05± 0.07 Sample 140.12± 0.1 Sample 15 *0.2± 0.12
    [60] -The space width is 0.1mm and the height of the optical waveguide device is 1.2mm.
    [61] -* Shows a comparative example.
    [62] As can be seen from this table, when the optical waveguide element is higher than the edge 21a of the concave groove portion, the difference is set to 0.1 mm or less, which is 1/10 of the thickness of the optical waveguide element, so that the temperature uniformity Up to ± 0.1 ° C can be achieved.
    [63] Next, in the optical waveguide module according to the third embodiment, the height of the edge portion 21a of the concave groove portion and the height of the optical waveguide element were changed relatively to measure the temperature uniformity of the optical waveguide element. The results are shown in Table 4. Here, the height of the optical waveguide element was 0.5 mm, and the width of the space between the optical waveguide element and the edge portion 21a of the concave groove portion was 0.1 mm.
    [64] Positional relationship between the optical waveguide element and the edge (mm)Temperature uniformity (℃) Sample 16 *0.01± 0.06 Sample 170.05± 0.06 Sample 180.1± 0.08 Sample 19 *0.2± 0.12
    [65] -The space width is 0.1mm, and the height of the optical waveguide device is 0.5mm.
    [66] -* Shows a comparative example.
    [67] As can be seen from this table, when the optical waveguide element is higher than the edge 21a of the concave groove portion, if the difference is 0.1 mm or less, even if not equal to 1/10 or less of the height of the optical waveguide element, temperature uniformity ± 0.1 degrees C or less can be achieved.
    [68] Further, in Experiment 3, Table 5 shows the results of Experiment 5 in which the height of the optical waveguide element is made lower than the height of the edge portion 21a of the concave groove portion.
    [69] Positional relationship between the optical waveguide element and the edge (mm)Temperature uniformity (℃) Sample 200.01± 0.07 Sample 210.05± 0.07 Sample 220.1± 0.07 Sample 230.2± 0.07
    [70] -The space width is 0.1mm and the height of the optical waveguide device is 1.2mm.
    [71] As can be seen from this table, when the edge portion 21a of the concave groove portion is higher than the optical waveguide element, temperature uniformity of 0.1 ° C. or less can be achieved.
    [72] As mentioned above, although the Example of this invention was described in detail, this invention is not limited to the said Example.
    [73] In the above embodiment, the optical waveguide element is made of quartz, but the optical waveguide element is not limited to quartz. For example, an optical waveguide element made of resin, silica, or LiNbO 3 may be used.
    [74] It is also possible to change the dimensions of the optical waveguide element.
    [75] Moreover, the material used for resin, case, etc. used for joining etc. is not limited to the said Example.
    [76] According to the present invention, a concave groove portion is formed in the heat transfer portion constituting the heater module, and the optical waveguide element is heated from the bottom and the side by placing the concave groove portion so as to insert the optical waveguide element. Thereby, the temperature uniformity of an optical waveguide element can be improved.
    [77] Further, according to the present invention, since the structure of heating the entire optical waveguide element is not formed, power consumption for heating the optical waveguide element can be reduced. Furthermore, the thickness of the optical waveguide module can be kept equal to that in the case where the optical waveguide element is simply placed on the heat transfer portion.
    权利要求:
    Claims (8)
    [1" claim-type="Currently amended] In the heater module for heating the optical waveguide device to control the temperature of the optical waveguide device,
    With a heat generation circuit which generates heat by electricity,
    And a heat transfer part provided on an upper surface of the heat generating circuit and having a concave groove portion for mounting the optical waveguide element.
    [2" claim-type="Currently amended] The heater module according to claim 1, wherein the heat transfer unit is made of AlN ceramics.
    [3" claim-type="Currently amended] The heater module according to claim 1, wherein an insulating layer is provided between said heat generating circuit and said heat transfer portion.
    [4" claim-type="Currently amended] The heater module of any one of Claims 1-3,
    An optical waveguide element mounted on the concave groove formed in the heat transfer part;
    And a case accommodating the heater module and the optical waveguide element.
    [5" claim-type="Currently amended] The gas-form medium is interposed between the edge of the concave portion and the optical waveguide element.
    The upper surface of the edge portion constituting the concave groove portion is higher than the upper surface of the optical waveguide element placed on the bottom surface of the concave groove portion, or the height difference with the upper surface of the optical waveguide element is 0.1 mm or less, or the optical waveguide element An optical waveguide module, characterized in that less than 1/10 of the height.
    [6" claim-type="Currently amended] The gas-form medium is interposed between the edge portion of the concave groove portion and the optical waveguide element.
    An optical waveguide module, wherein a width of a space partitioned between the edge portion and the optical waveguide element is 0.02 mm or more and 1.0 mm or less.
    [7" claim-type="Currently amended] The optical waveguide module according to claim 4, further comprising a resin interposed in a space partitioned between the edge portion and the optical waveguide element.
    [8" claim-type="Currently amended] 8. The optical waveguide module according to claim 7, wherein the resin is made of a grease type material.
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    TW516335B|2003-01-01|
    DE60113350D1|2005-10-20|
    EP1191361B1|2005-09-14|
    US20020057884A1|2002-05-16|
    JP2002098844A|2002-04-05|
    CA2357790C|2005-05-24|
    CA2357790A1|2002-03-25|
    US6618539B2|2003-09-09|
    EP1191361A1|2002-03-27|
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    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    法律状态:
    2000-09-25|Priority to JP2000290710A
    2000-09-25|Priority to JPJP-P-2000-00290710
    2001-09-24|Application filed by 오카야마 노리오, 스미토모덴키고교가부시키가이샤
    2002-03-30|Publication of KR20020024544A
    优先权:
    申请号 | 申请日 | 专利标题
    JP2000290710A|JP2002098844A|2000-09-25|2000-09-25|Heater module and optical waveguide module|
    JPJP-P-2000-00290710|2000-09-25|
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